OmniSIM Product Datasheet
This documentation applies to the following products:
OmniSIM
For all other products, please review their respective documentation
KORE OmniSIM SKU - Products
| OmiSIM Product | Triple | 2FF | 3FF | MFF2 | USON8-6 |
|---|---|---|---|---|---|
OmniSIM Reach 1.3 | 17493 | 17495 | 17494 | 17536 | 18491 |
OmniSIM Rush 1.3 | 17496 | 17498 | 17497 | 17537 | - |
OmniSIM US 1.3 | 17844 | 18643* | 18195* | 18642 | - |
OmniSIM SAFE Reach 1.3 | 17570 | - | - | - | - |
Offering as of 07/08/2024 subject to change.
KORE SKU’s listed, if blank speak to your sales contact for options.
*This SKU is not normally held in stock so see the lead time section to see lead time from Manufacturer.
Form Factors
KORE supports a wide range of form factors.
Removable products the 4FF / Chip is the same thickness as the rest of the card as this helps get a good contact in a M2M device. The 4FF might be tight in a Smartphone that is expecting 0.67mm Nano SIM.
eSIM Specifications
KORE OmniSIM is engineered for the M2M/IoT market, utilizing an Industrial Grade chipset by default.
eSIM Hardware
| Hardware Features | OmniSIM Removable / Embedded |
|---|---|
AVAILABLE FORMATS | Triple / 2FF / 3FF / 4FF / MFF2 / USON8-6 |
CHIPSET | Infineon SLM 17ECB800B |
MEMORY (FLASH) | 800kb |
MEMORY (RAM) | 20kb |
DATA RETENTION | 10 years @ 25°C |
ENDURANCE CYCLES (ETSI TS 102 221) | Min 3.2M Write / page (16 byte block) Min 200k Erase / page |
VOLTAGE RANGE | 1.62 – 5.5V External clock: 1 to 10 MHz |
TEMPERATURE RANGE(TX) | -40°C to 105°C |
HUMIDITY (HX) | 85ºC, 85% humidity, 1000hrs |
CORROSION (CX) | Salt atmosphere corrosion test: 24 hours |
eSIM OS
| OS Features | OmniSIM Removable / Embedded |
|---|---|
eUICC/eSIM OS | Kigen / EMu10.24 |
GSMA SGP | SGP.02 v4.2 (M2M) |
PROFILE | KORE Wireless |
CONNECTVITY | 2G/3G/4G/LTE/LTE-M - according to the profile |
JAVACARD | 3.0.5 |
GLOBAL PLATFORM | 2.1.1 |
SIM Standards
ISO Standards
ISO 10373-1: Provides test methods for cards.
ISO 7810: Establishes the physical characteristics of identification cards.
ISO 7816: Specifies the characteristics of cards with contacts and their operational conditions.
ETSI Standards
ETSI TS 101 220: Specifications for application management in a multi-application environment.
ETSI TS 102 221: Technical specifications for the UICC-Terminal interface; Physical and logical characteristics.
ETSI TS 102 241: Security architecture for Smart Cards.
ETSI TS 102 267: Application Program Interface (API) for Open Platform.
ETSI TS 102 671: Remote APDU structure for UICC based applications.
Security Certification
Common Criteria EAL 5+: A security certification indicating a high level of assurance in the product's security features.
Product Compliance Information
Export Control Classification Number (ECCN): 5A992.c
U.S. Harmonized Tariff Schedule (HTS): 8523.52.0010
Country of Origin: Varies, depending on the SIM supplier.
ROHS Compliance: All KORE SIM suppliers adhere to ROHS standards. (Documentation available upon request)
REACH Compliance: All KORE SIM suppliers meet REACH standards. (Documentation available upon request)
Toxic Substances Control Act (TSCA): Complient to Section 6(h). (Documentation available upon request)
SIM Card Manufacturers
Workz, Dubai
Beautiful Card Company (BCC), Taiwan
These companies adhere to the SIM manufacturing process standards as outlined by the Global System for Mobile Communications Association (GSMA), specifically the Security Accreditation Scheme for UICC Production (SAS-UP) and the Security Accreditation Scheme for Subscription Management (SAS-SM)
Delivery Lead Times
| Product | KORE Warehouse | Order from Manufacturer for existing SKU's |
|---|---|---|
OmniSIM (Removable) | 1 week | 4-6 weeks |
OmniSIM (Embedded) | 1 week | 6-8 weeks |
OmniSIM Downloadable | Immediate | - |
Removable eSIM
Graphical Personalization
Removable OmniSIM now comes in KORE Branded Half-Size format.
EID is printed in full (32 digits) under the barcode which also contains the EID in full so can be scanned with a barcode scanner.
The pop-out/chip part has the last 24 digits of the EID printed on the back. This is because the first 8 digits (89001039) are contant for KORE.
SKU is now printed on the back of the card body for easy identification on the type of OmniSIM.
Physical Characteristics
The KORE OmniSIM is crafted from ABS plastic, enhancing its durability for M2M/IoT applications, particularly in environments that reach temperatures up to 105°C. Furthermore, ABS plastic is more environmentally friendly compared to traditional PVC-based SIM cards, as it is easier to recycle.
Emedded MFF2 eSIM
Graphical Personalization
EID (marked in orange) is the last 27 digts. This is because the first 5 digits (89001) are constant for KORE.
Chip product code (marked in yellow) is related to the Infineon production and is not defined by KORE.
Embedded MFF2 Technical Diagram
Embedded MFF2 eSIM Pin Information
The following documents the key pin information for an embedded MFF2 eSIM module:
C1 - VDD/VCC: Power supply
C2 - RST: Reset signal
C3 - CLK: Clock signal
C5 - VSS/GND: Ground connection
C7 - IO: Input/Output communication line
Section 5 of ETSI TS 102 221 outlines the characteristics of the eUICC PINs.
Emedded USON8-6 eSIM
Graphical Personalization
EID (marked in orange) is the last 5 digts not including the 2 Luhn (check) digits on the end.
Example EID: 8900103945061014140000000
The last 5 digits of the EID are 12345 and 80 is the Luhn (check) digits
Chip product code (marked in yellow) is related to the Infineon production and is not defined by KORE.
Embedded USON8-6 Technical Diagram
Embedded USON8-6 eSIM Pin Information
The following documents the key pin information for an embedded USON8-6 eSIM module:
C1 - VDD/VCC: Power supply
C2 - RST: Reset signal
C3 - CLK: Clock signal
C5 - VSS/GND: Ground connection
C7 - IO: Input/Output communication line
Section 5 of ETSI TS 102 221 outlines the characteristics of the eUICC PINs.
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