OmniSIM Product Datasheet
Last updated
Last updated
This documentation applies to the following products:
OmniSIM
For all other products, please review their respective documentation
| OmiSIM Product | Triple | 2FF | 3FF | MFF2 | USON8-6 |
|---|---|---|---|---|---|
OmniSIM Reach 1.3 | 17493 | 17495 | 17494 | 17536 | 18491 |
OmniSIM Rush 1.3 | 17496 | 17498 | 17497 | 17537 | - |
OmniSIM US 1.3 | 17844 | 18643* | 18195* | 18642 | - |
Offering as of 07/08/2024 subject to change.
KORE SKU’s listed, if blank speak to your sales contact for options.
*This SKU is not normally held in stock so see the lead time section to see lead time from Manufacturer.
KORE supports a wide range of form factors.
Removable products the 4FF / Chip is the same thickness as the rest of the card as this helps get a good contact in a M2M device. The 4FF might be tight in a Smartphone that is expecting 0.67mm Nano SIM.
KORE OmniSIM is engineered for the M2M/IoT market, utilizing an Industrial Grade chipset by default.
| Hardware Features | OmniSIM Removable / Embedded |
|---|---|
AVAILABLE FORMATS | Triple / 2FF / 3FF / 4FF / MFF2 / USON8-6 |
CHIPSET | Infineon SLM 17ECB800B |
MEMORY (FLASH) | 800kb |
MEMORY (RAM) | 20kb |
DATA RETENTION | 10 years @ 25°C |
ENDURANCE CYCLES (ETSI TS 102 221) | Min 3.2M Write / page (16 byte block) Min 200k Erase / page |
VOLTAGE RANGE | 1.62 – 5.5V External clock: 1 to 10 MHz |
TEMPERATURE RANGE(TX) | -40°C to 105°C |
HUMIDITY (HX) | 85ºC, 85% humidity, 1000hrs |
CORROSION (CX) | Salt atmosphere corrosion test: 24 hours |
| OS Features | OmniSIM Removable / Embedded |
|---|---|
eUICC/eSIM OS | Kigen / EMu10.24 |
GSMA SGP | SGP.02 v4.2 (M2M) |
PROFILE | KORE Wireless |
CONNECTVITY | 2G/3G/4G/LTE/LTE-M - according to the profile |
JAVACARD | 3.0.5 |
GLOBAL PLATFORM | 2.1.1 |
ISO 10373-1: Provides test methods for cards.
ISO 7810: Establishes the physical characteristics of identification cards.
ISO 7816: Specifies the characteristics of cards with contacts and their operational conditions.
ETSI TS 101 220: Specifications for application management in a multi-application environment.
ETSI TS 102 221: Technical specifications for the UICC-Terminal interface; Physical and logical characteristics.
ETSI TS 102 241: Security architecture for Smart Cards.
ETSI TS 102 267: Application Program Interface (API) for Open Platform.
ETSI TS 102 671: Remote APDU structure for UICC based applications.
Common Criteria EAL 5+: A security certification indicating a high level of assurance in the product's security features.
Export Control Classification Number (ECCN): 5A992.c
U.S. Harmonized Tariff Schedule (HTS): 8523.52.0010
Country of Origin: Varies, depending on the SIM supplier.
ROHS Compliance: All KORE SIM suppliers adhere to ROHS standards. (Documentation available upon request)
REACH Compliance: All KORE SIM suppliers meet REACH standards. (Documentation available upon request)
Toxic Substances Control Act (TSCA): Complient to Section 6(h). (Documentation available upon request)
Workz, Dubai
Beautiful Card Company (BCC), Taiwan
These companies adhere to the SIM manufacturing process standards as outlined by the Global System for Mobile Communications Association (GSMA), specifically the Security Accreditation Scheme for UICC Production (SAS-UP) and the Security Accreditation Scheme for Subscription Management (SAS-SM)
| Product | KORE Warehouse | Order from Manufacturer for existing SKU's |
|---|---|---|
OmniSIM (Removable) | 1 week | 4-6 weeks |
OmniSIM (Embedded) | 1 week | 6-8 weeks |
OmniSIM Downloadable | Immediate | - |
KORE Warehouse - where the product is held in inventory by KORE, some SKU/form factors may not be held in inventory by KORE, may require a specific order from our supplier.
| Product | KORE CMP | Drop Ship from Manufacturer |
|---|---|---|
OmniSIM (Removable) | 1+ | MoQ 20k |
OmniSIM (Embedded) | Multiples of 500 | MoQ 10k (Can supply in reels of 500 / 1000 / 3000 / 5000) |
KORE CMP - This could be an order placed through ConnectivityPro Stock Order or via your sales channel.
Embedded (MFF2/USON) products are delivered on reels and sealed in MSL 3 anti static moisture barrier bags, then boxed for protection.
Reel Sizes
500 (this is KORE's default size, held in stock)
1000
3000
5000
Removable OmniSIM now comes in KORE Branded Half-Size format.
EID is printed in full (32 digits) under the barcode which also contains the EID in full so can be scanned with a barcode scanner.
The pop-out/chip part has the last 24 digits of the EID printed on the back. This is because the first 8 digits (89001039) are contant for KORE.
SKU is now printed on the back of the card body for easy identification on the type of OmniSIM.
The KORE OmniSIM is crafted from ABS plastic, enhancing its durability for M2M/IoT applications, particularly in environments that reach temperatures up to 105°C. Furthermore, ABS plastic is more environmentally friendly compared to traditional PVC-based SIM cards, as it is easier to recycle.
EID (marked in orange) is the last 27 digts. This is because the first 5 digits (89001) are constant for KORE.
Chip product code (marked in yellow) is related to the Infineon production and is not defined by KORE.
The following documents the key pin information for an embedded MFF2 eSIM module:
C1 - VDD/VCC: Power supply
C2 - RST: Reset signal
C3 - CLK: Clock signal
C5 - VSS/GND: Ground connection
C7 - IO: Input/Output communication line
Section 5 of ETSI TS 102 221 outlines the characteristics of the eUICC PINs.
EID (marked in orange) is the last 5 digts not including the 2 Luhn (check) digits on the end.
Example EID: 8900103945061014140000000
The last 5 digits of the EID are 12345 and 80 is the Luhn (check) digits
Chip product code (marked in yellow) is related to the Infineon production and is not defined by KORE.
The following documents the key pin information for an embedded USON8-6 eSIM module:
C1 - VDD/VCC: Power supply
C2 - RST: Reset signal
C3 - CLK: Clock signal
C5 - VSS/GND: Ground connection
C7 - IO: Input/Output communication line
Section 5 of ETSI TS 102 221 outlines the characteristics of the eUICC PINs.
