Super SIM datasheet

Specifications

SIM Hardware

Super SIM

Industrial

eSIM removable

eSIM MFF2

SIM type

eUICC - Consumer

eUICC - Industrial grade

Consumer eSIM (SGP.22) - Consumer grade

Consumer eSIM (SGP.22) - Industrial grade

Availalbe form factors

Triple

2FF / 3FF / 4FF / MFF2 / MFF-XS

Triple

MFF2 / MFF-X

Data retension

10 years

10 year

15 years

Endurance cycles (ETSI TS 102 221)

>100k

>1M

Voltage range

3V (class B) and 1.8V (class C)

External clock: 1 to 5 MHz

5V (class A), 3V (class B), and 1.8V (class C)

External clock: 1 to 10 MHz

3V (class B), and 1.8V (class C)

External clock: 1 to 10 MHz

3V (class B), and 1.8V (class C)

External clock: 1 to 10 MHz

Temperature range (TX)

-25°C to +85°C

-40°C to +105°C

-40°C to +85°

-40°C to +105°C

Humidity (HX)

85°C / 85%Hr 1000h with bias

Corrosion (CX)

Salt atmosphere at 35°C, 96h

Low power support

Yes (UICC suspend)

ISO standards

ISO 10373-1: Provides test methods for cards.
ISO 7810: Establishes the physical characteristics of identification cards.
ISO 7816: Specifies the characteristics of cards with contacts and their operational conditions.

ETSI standards

ETSI TS 101 220: Specifications for application management in a multi-application environment.
ETSI TS 102 221: Technical specifications for the UICC-Terminal interface; Physical and logical characteristics.
ETSI TS 102 241: Security architecture for Smart Cards.
ETSI TS 102 267: Connection Oriented Service API for the Java Card platform (BIP and CAT-TP feature). Supported on Industrial SIM product, not supported on Super SIM.
ETSI TS 102 671: Remote APDU structure for UICC-based applications.

eSIM (SGP.22) consumer standards

eSIM OS features

Super SIM removable / embedded

GSMA Remote SIM Provisioning (RSP) for eUICC technical specification

SGP.22 v2

GSMA Remote SIM Remote Provisioning (RSP) architecture for eUICC

SGP.21 v2.2

GSMA Embedded UICC for consumer device protection profile

SGP.25 v1.0

GSMA RSP compliance process

SGP.24

Java Card

3.0.5

GlobalPlatform card

v2.3

Security certification

Common Criteria EAL 5+: A security certification indicating a high level of assurance in the product's security features.

Product compliance information

Export Control Classification Number (ECCN): 5A992.c
Harmonized Tariff Schedule of the United States (HTS): 8523.52.0010
RoHS compliance: All KORE SIM suppliers adhere to RoHS standards. (Documentation available upon request)
REACH compliance: All KORE SIM suppliers meet REACH standards. (Documentation available upon request)
Toxic Substances Control Act (TSCA): Compliant to Section 6(h). (Documentation available upon request)
SIM production:
- Country of origin: Mexico or China
- Our supplier companies adhere to the SIM manufacturing process standards as outlined by the Global System for Mobile Communications Association (GSMA), specifically the Security Accreditation Scheme for UICC Production (SAS-UP) and the Security Accreditation Scheme for Subscription Management (SAS-SM)

Delivery lead times

Delivery times vary by product and shipping location.

Product

KORE warehouse

Drop ship

Super SIM

1 week

4-6 weeks

Super SIM Industrial / eSIM

4-6 weeks

Super SIM downloadable profiles

Immediate via API

KORE warehouse - where the product is held in inventory by KORE; some SKU/form factors may not be held in inventory by KORE and may require a specific order from our supplier.

Order quantities

Product

KORE Console

Drop ship

Super SIM Removable

1 - 10k

MoQ 10k

Super SIM MFF2

10 / 100 / 1000

MoQ 10k

KORE Console - This could be an order placed through the console or your sales channel.
Embedded (MFF2) products are delivered in bags or on reels and sealed in MSL 3 anti-static moisture barrier bags, then boxed for protection.
- Bags
  - 10
  - 100
- Reel sizes
  - 1000
  - 3000
  - 5000

Form factors

KORE supports a wide range of form factors.

Removable SIM card

KORE Super SIM standard

The KORE Super SIM standard product is branded, industrial, and eSIM products will be provided in plain white format.
ICCID is printed in full (20 digits) under the barcode, which also contains the ICCID in full, so it can be scanned with a barcode scanner.
The pop-out/chip part has the ICCID printed on the back.
On the back of the SIM, there is a 10 alpha-numeric code that can be used to register the SIM in the console (korewireless.com/register-supersim)

Physical characteristics

The KORE Super SIM is crafted from ABS plastic, enhancing its durability for M2M/IoT applications, particularly in environments that reach temperatures up to 105°C. Furthermore, ABS plastic is more environmentally friendly than traditional PVC-based SIM cards, as recycling is easier.