Super SIM Datasheet

Specifications

SIM Hardware

	Super SIM	Industrial	eSIM removable	eSIM MFF2
SIM type	UICC - Consumer	UICC - Industrial grade	Consumer eSIM (SGP.22) - Consumer grade	Consumer eSIM (SGP.22) - Industrial grade
Available form factors	Triple	2FF / 3FF / MFF2 / MFF-XS	Triple	MFF2 / MFF-X
Data retension	10 years	15 years	10 year	15 years
Endurance cycles (ETSI TS 102 221)	>20 million with OS Wear Leveling	>20 million with OS Wear Leveling	>20 million with OS Wear Leveling	>20 million with OS Wear Leveling
Voltage range	3V (class B) and 1.8V (class C) External clock: 1 to 5 MHz	5V (class A), 3V (class B), and 1.8V (class C) External clock: 1 to 10 MHz	3V (class B), and 1.8V (class C) External clock: 1 to 10 MHz	3V (class B), and 1.8V (class C) External clock: 1 to 10 MHz
Temperature range (TX)	-25°C to +85°C	-40°C to +105°C	-40°C to +85°	-40°C to +105°C
Humidity (HX)	-	85°C / 85%Hr 1000h with bias	-	85°C / 85%Hr 1000h with bias
Corrosion (CX)	-	Salt atmosphere at 35°C, 96h	-	Salt atmosphere at 35°C, 96h
Low power support	No	Yes (UICC suspend)	Yes (UICC suspend)	Yes (UICC suspend)

ISO standards

• ISO 10373-1: Provides test methods for cards.

• ISO 7810: Establishes the physical characteristics of identification cards.

• ISO 7816: Specifies the characteristics of cards with contacts and their operational conditions.

ETSI standards

• ETSI TS 101 220: Specifications for application management in a multi-application environment.

• ETSI TS 102 221: Technical specifications for the UICC-Terminal interface; Physical and logical characteristics.

• ETSI TS 102 241: Security architecture for Smart Cards.

• ETSI TS 102 267: Connection Oriented Service API for the Java Card platform (BIP and CAT-TP feature). Supported on Industrial SIM product, not supported on Super SIM.

• ETSI TS 102 671: Remote APDU structure for UICC-based applications.

eSIM (SGP.22) consumer standards

eSIM OS features	Super SIM removable / embedded
GSMA Remote SIM Provisioning (RSP) for eUICC technical specification	SGP.22 v2
GSMA Remote SIM Remote Provisioning (RSP) architecture for eUICC	SGP.21 v2.2
GSMA Embedded UICC for consumer device protection profile	SGP.25 v1.0
GSMA RSP compliance process	SGP.24
Java Card	3.0.5
GlobalPlatform card	v2.3

Security certification

• Common Criteria EAL 5+: A security certification indicating a high level of assurance in the product's security features.

Product compliance information

• Export Control Classification Number (ECCN): 5A992.c

• Harmonized Tariff Schedule of the United States (HTS): 8523.52.0010

• RoHS compliance: All KORE SIM suppliers adhere to RoHS standards. (Documentation available upon request)

• REACH compliance: All KORE SIM suppliers meet REACH standards. (Documentation available upon request)

• Toxic Substances Control Act (TSCA): Compliant to Section 6(h). (Documentation available upon request)

• SIM production:

  • Country of origin: Mexico or China

  • Our supplier companies adhere to the SIM manufacturing process standards as outlined by the Global System for Mobile Communications Association (GSMA), specifically the Security Accreditation Scheme for UICC Production (SAS-UP) and the Security Accreditation Scheme for Subscription Management (SAS-SM)

Delivery lead times

Delivery times vary by product and shipping location.

Product	KORE warehouse	Drop ship
Super SIM	1 week	4-6 weeks
Super SIM Industrial / eSIM	-	4-6 weeks
Super SIM downloadable profiles	Immediate via API

KORE warehouse - where the product is held in inventory by KORE; some SKU/form factors may not be held in inventory by KORE and may require a specific order from our supplier.

Order quantities

Product	KORE Console	Drop ship
Super SIM Removable	1 - 10k	MoQ 10k
Super SIM MFF2	10 / 100 / 1000	MoQ 10k

• KORE Console - This could be an order placed through the console or your sales channel.

• Embedded (MFF2) products are delivered in bags or on reels and sealed in MSL 3 anti-static moisture barrier bags, then boxed for protection.

  • Bags

    • 10

    • 100

  • Reel sizes

    • 1000

    • 3000

    • 5000

Form factors

KORE supports a wide range of form factors.

Form factor options

Removable SIM card

KORE Super SIM standard

Super SIM card

• The KORE Super SIM standard product is branded, industrial, and eSIM products will be provided in plain white format.

• ICCID is printed in full (20 digits) under the barcode, which also contains the ICCID in full, so it can be scanned with a barcode scanner.

• The pop-out/chip part has the ICCID printed on the back.

• On the back of the SIM, there is a 10 alpha-numeric code that can be used to register the SIM in the console (korewireless.com/register-supersim)

Physical characteristics

• The KORE Super SIM is crafted from ABS plastic, enhancing its durability for M2M/IoT applications, particularly in environments that reach temperatures up to 105°C. Furthermore, ABS plastic is more environmentally friendly than traditional PVC-based SIM cards, as recycling is easier.

Embedded MFF2

Embedded MFF2 SIM

• ICCID (marked in orange)

• Chip product code (marked in yellow) is related to supplier production and is not defined by KORE.

Embedded MFF2 technical diagram

Embedded MFF2 diagram

Embedded MFF2 eSIM pin information

The key pin information for an embedded MFF2 eSIM module includes:

• C1 - VDD/VCC: Power supply

• C2 - RST: Reset signal

• C3 - CLK: Clock signal

• C5 - VSS/GND: Ground connection

• C7 - IO: Input/Output communication line

Section 5 of ETSI TS 102 221 outlines the characteristics of the eUICC PINs.

eUICC pin diagram