# Super SIM Datasheet

## Specifications

### SIM Hardware

|                                    | Super SIM                                                                | Industrial                                                                               | eSIM removable                                                             | eSIM MFF2                                                                  |
| ---------------------------------- | ------------------------------------------------------------------------ | ---------------------------------------------------------------------------------------- | -------------------------------------------------------------------------- | -------------------------------------------------------------------------- |
| SIM type                           | UICC - Consumer                                                          | UICC - Industrial grade                                                                  | Consumer eSIM (SGP.22) - Consumer grade                                    | Consumer eSIM (SGP.22) - Industrial grade                                  |
| Available form factors             | Triple                                                                   | 2FF / 3FF / MFF2 / MFF-XS                                                                | Triple                                                                     | MFF2 / MFF-X                                                               |
| Data retension                     | 10 years                                                                 | 15 years                                                                                 | 10 year                                                                    | 15 years                                                                   |
| Endurance cycles (ETSI TS 102 221) | >20 million with OS Wear Leveling                                        | >20 million with OS Wear Leveling                                                        | >20 million with OS Wear Leveling                                          | >20 million with OS Wear Leveling                                          |
| Voltage range                      | <p>3V (class B) and 1.8V (class C) </p><p>External clock: 1 to 5 MHz</p> | <p>5V (class A), 3V (class B), and 1.8V (class C) </p><p>External clock: 1 to 10 MHz</p> | <p>3V (class B), and 1.8V (class C) </p><p>External clock: 1 to 10 MHz</p> | <p>3V (class B), and 1.8V (class C) </p><p>External clock: 1 to 10 MHz</p> |
| Temperature range (TX)             | -25°C to +85°C                                                           | -40°C to +105°C                                                                          | -40°C to +85°                                                              | -40°C to +105°C                                                            |
| Humidity (HX)                      | -                                                                        | 85°C / 85%Hr 1000h with bias                                                             | -                                                                          | 85°C / 85%Hr 1000h with bias                                               |
| Corrosion (CX)                     | -                                                                        | Salt atmosphere at 35°C, 96h                                                             | -                                                                          | Salt atmosphere at 35°C, 96h                                               |
| Low power support                  | No                                                                       | Yes (UICC suspend)                                                                       | Yes (UICC suspend)                                                         | Yes (UICC suspend)                                                         |

### **ISO standards**

* **ISO 10373-1**: Provides test methods for cards.
* **ISO 7810**: Establishes the physical characteristics of identification cards.
* **ISO 7816**: Specifies the characteristics of cards with contacts and their operational conditions.

### ETSI standards

* **ETSI TS 101 220:** Specifications for application management in a multi-application environment.
* **ETSI TS 102 221:** Technical specifications for the UICC-Terminal interface; Physical and logical characteristics.
* **ETSI TS 102 241:** Security architecture for Smart Cards.
* **ETSI TS 102 267:** Connection Oriented Service API for the Java Card platform (BIP and CAT-TP feature). Supported on Industrial SIM product, not supported on Super SIM.
* **ETSI TS 102 671:** Remote APDU structure for UICC-based applications.&#x20;

### eSIM (SGP.22) consumer standards

| eSIM OS features                                                     | Super SIM removable / embedded |
| -------------------------------------------------------------------- | ------------------------------ |
| GSMA Remote SIM Provisioning (RSP) for eUICC technical specification | SGP.22 v2                      |
| GSMA Remote SIM Remote Provisioning (RSP) architecture for eUICC     | SGP.21 v2.2                    |
| GSMA Embedded UICC for consumer device protection profile            | SGP.25 v1.0                    |
| GSMA RSP compliance process                                          | SGP.24                         |
| Java Card                                                            | 3.0.5                          |
| GlobalPlatform card                                                  | v2.3                           |

####

#### Security certification

* **Common Criteria EAL 5+:** A security certification indicating a high level of assurance in the product's security features.

## Product compliance information <a href="#product-compliance-information" id="product-compliance-information"></a>

* **Export Control Classification Number (ECCN):** 5A992.c
* **Harmonized Tariff Schedule of the United States (HTS):** 8523.52.0010
* **RoHS compliance:** All KORE SIM suppliers adhere to RoHS standards. (Documentation available upon request)
* **REACH compliance:** All KORE SIM suppliers meet REACH standards. (Documentation available upon request)
* **Toxic Substances Control Act (TSCA):** Compliant to Section 6(h). (Documentation available upon request)
* **SIM production:**
  * **Country of origin:** Mexico or China
  * Our supplier companies adhere to the SIM manufacturing process standards as outlined by the Global System for Mobile Communications Association (GSMA), specifically the Security Accreditation Scheme for UICC Production (SAS-UP) and the Security Accreditation Scheme for Subscription Management (SAS-SM)

## Delivery lead times

Delivery times vary by product and shipping location.

| Product                         | KORE warehouse    | Drop ship |
| ------------------------------- | ----------------- | --------- |
| Super SIM                       | 1 week            | 4-6 weeks |
| Super SIM Industrial / eSIM     | -                 | 4-6 weeks |
| Super SIM downloadable profiles | Immediate via API |           |

KORE warehouse - where the product is held in inventory by KORE; some SKU/form factors may not be held in inventory by KORE and may require a specific order from our supplier.

## Order quantities <a href="#order-quantities" id="order-quantities"></a>

| Product             | KORE Console    | Drop ship |
| ------------------- | --------------- | --------- |
| Super SIM Removable | 1 - 10k         | MoQ 10k   |
| Super SIM MFF2      | 10 / 100 / 1000 | MoQ 10k   |

* KORE Console - This could be an order placed through the console or your sales channel.
* Embedded (MFF2) products are delivered in bags or on reels and sealed in MSL 3 anti-static moisture barrier bags, then boxed for protection.
  * Bags
    * 10
    * 100
  * Reel sizes
    * 1000
    * 3000
    * 5000

## Form factors

KORE supports a wide range of form factors.

<figure><img src="/files/UGg4AlzAjUsqXrE1IDSy" alt=""><figcaption><p>Form factor options</p></figcaption></figure>

## Removable SIM card <a href="#removable-esim" id="removable-esim"></a>

### KORE Super SIM standard

<div align="left"><figure><img src="/files/iZNi17gTHj7Ijw2Tqzil" alt="Super SIM removable card" width="347"><figcaption><p>Super SIM card</p></figcaption></figure></div>

* The KORE Super SIM standard product is branded, industrial, and eSIM products will be provided in plain white format.
* ICCID is printed in full (20 digits) under the barcode, which also contains the ICCID in full, so it can be scanned with a barcode scanner.
* The pop-out/chip part has the ICCID printed on the back.
* On the back of the SIM, there is a 10 alpha-numeric code that can be used to register the SIM in the console ([korewireless.com/register-supersim](https://korewireless.com/register-supersim))

#### Physical characteristics

* The KORE Super SIM is crafted from ABS plastic, enhancing its durability for M2M/IoT applications, particularly in environments that reach temperatures up to 105°C. Furthermore, ABS plastic is more environmentally friendly than traditional PVC-based SIM cards, as recycling is easier.

## Embedded MFF2  <a href="#emedded-mff2-esim" id="emedded-mff2-esim"></a>

<div align="left"><figure><img src="/files/AuY182uo8P2Ep5fAztdX" alt="Embedded MFF2 SIM" width="264"><figcaption><p>Embedded MFF2 SIM</p></figcaption></figure></div>

* ICCID (marked in orange)
* Chip product code (marked in yellow) is related to supplier production and is not defined by KORE.

### Embedded MFF2 technical diagram <a href="#embedded-mff2-technical-diagram" id="embedded-mff2-technical-diagram"></a>

<div align="left"><figure><img src="/files/We4BizBEKqwhDpTLbF6i" alt="Embedded MFF2 diagram" width="375"><figcaption><p>Embedded MFF2 diagram</p></figcaption></figure></div>

### Embedded MFF2 eSIM pin information <a href="#embedded-mff2-esim-pin-information" id="embedded-mff2-esim-pin-information"></a>

The key pin information for an embedded MFF2 eSIM module includes:

* **C1 - VDD/VCC**: Power supply
* **C2 - RST**: Reset signal
* **C3 - CLK**: Clock signal
* **C5 - VSS/GND**: Ground connection
* **C7 - IO**: Input/Output communication line

Section 5 of[ ETSI TS 102 221](https://www.etsi.org/deliver/etsi_ts/102200_102299/102221/17.01.00_60/ts_102221v170100p.pdf) outlines the characteristics of the eUICC PINs.

<div align="left"><figure><img src="/files/fGgjM8roJ1UG6Na3eifU" alt="eUICC pin diagram"><figcaption><p>eUICC pin diagram</p></figcaption></figure></div>


---

# Agent Instructions: Querying This Documentation

If you need additional information that is not directly available in this page, you can query the documentation dynamically by asking a question.

Perform an HTTP GET request on the current page URL with the `ask` query parameter:

```
GET https://docs.korewireless.com/supersim/into-production/super-sim-datasheet.md?ask=<question>
```

The question should be specific, self-contained, and written in natural language.
The response will contain a direct answer to the question and relevant excerpts and sources from the documentation.

Use this mechanism when the answer is not explicitly present in the current page, you need clarification or additional context, or you want to retrieve related documentation sections.