# Super SIM Datasheet

## Specifications

### SIM Hardware

|                                    | Super SIM                                                                | Industrial                                                                               | eSIM removable                                                             | eSIM MFF2                                                                  |
| ---------------------------------- | ------------------------------------------------------------------------ | ---------------------------------------------------------------------------------------- | -------------------------------------------------------------------------- | -------------------------------------------------------------------------- |
| SIM type                           | UICC - Consumer                                                          | UICC - Industrial grade                                                                  | Consumer eSIM (SGP.22) - Consumer grade                                    | Consumer eSIM (SGP.22) - Industrial grade                                  |
| Available form factors             | Triple                                                                   | 2FF / 3FF / MFF2 / MFF-XS                                                                | Triple                                                                     | MFF2 / MFF-X                                                               |
| Data retension                     | 10 years                                                                 | 15 years                                                                                 | 10 year                                                                    | 15 years                                                                   |
| Endurance cycles (ETSI TS 102 221) | >20 million with OS Wear Leveling                                        | >20 million with OS Wear Leveling                                                        | >20 million with OS Wear Leveling                                          | >20 million with OS Wear Leveling                                          |
| Voltage range                      | <p>3V (class B) and 1.8V (class C) </p><p>External clock: 1 to 5 MHz</p> | <p>5V (class A), 3V (class B), and 1.8V (class C) </p><p>External clock: 1 to 10 MHz</p> | <p>3V (class B), and 1.8V (class C) </p><p>External clock: 1 to 10 MHz</p> | <p>3V (class B), and 1.8V (class C) </p><p>External clock: 1 to 10 MHz</p> |
| Temperature range (TX)             | -25°C to +85°C                                                           | -40°C to +105°C                                                                          | -40°C to +85°                                                              | -40°C to +105°C                                                            |
| Humidity (HX)                      | -                                                                        | 85°C / 85%Hr 1000h with bias                                                             | -                                                                          | 85°C / 85%Hr 1000h with bias                                               |
| Corrosion (CX)                     | -                                                                        | Salt atmosphere at 35°C, 96h                                                             | -                                                                          | Salt atmosphere at 35°C, 96h                                               |
| Low power support                  | No                                                                       | Yes (UICC suspend)                                                                       | Yes (UICC suspend)                                                         | Yes (UICC suspend)                                                         |

### **ISO standards**

* **ISO 10373-1**: Provides test methods for cards.
* **ISO 7810**: Establishes the physical characteristics of identification cards.
* **ISO 7816**: Specifies the characteristics of cards with contacts and their operational conditions.

### ETSI standards

* **ETSI TS 101 220:** Specifications for application management in a multi-application environment.
* **ETSI TS 102 221:** Technical specifications for the UICC-Terminal interface; Physical and logical characteristics.
* **ETSI TS 102 241:** Security architecture for Smart Cards.
* **ETSI TS 102 267:** Connection Oriented Service API for the Java Card platform (BIP and CAT-TP feature). Supported on Industrial SIM product, not supported on Super SIM.
* **ETSI TS 102 671:** Remote APDU structure for UICC-based applications.&#x20;

### eSIM (SGP.22) consumer standards

| eSIM OS features                                                     | Super SIM removable / embedded |
| -------------------------------------------------------------------- | ------------------------------ |
| GSMA Remote SIM Provisioning (RSP) for eUICC technical specification | SGP.22 v2                      |
| GSMA Remote SIM Remote Provisioning (RSP) architecture for eUICC     | SGP.21 v2.2                    |
| GSMA Embedded UICC for consumer device protection profile            | SGP.25 v1.0                    |
| GSMA RSP compliance process                                          | SGP.24                         |
| Java Card                                                            | 3.0.5                          |
| GlobalPlatform card                                                  | v2.3                           |

####

#### Security certification

* **Common Criteria EAL 5+:** A security certification indicating a high level of assurance in the product's security features.

## Product compliance information <a href="#product-compliance-information" id="product-compliance-information"></a>

* **Export Control Classification Number (ECCN):** 5A992.c
* **Harmonized Tariff Schedule of the United States (HTS):** 8523.52.0010
* **RoHS compliance:** All KORE SIM suppliers adhere to RoHS standards. (Documentation available upon request)
* **REACH compliance:** All KORE SIM suppliers meet REACH standards. (Documentation available upon request)
* **Toxic Substances Control Act (TSCA):** Compliant to Section 6(h). (Documentation available upon request)
* **SIM production:**
  * **Country of origin:** Mexico or China
  * Our supplier companies adhere to the SIM manufacturing process standards as outlined by the Global System for Mobile Communications Association (GSMA), specifically the Security Accreditation Scheme for UICC Production (SAS-UP) and the Security Accreditation Scheme for Subscription Management (SAS-SM)

## Delivery lead times

Delivery times vary by product and shipping location.

| Product                         | KORE warehouse    | Drop ship |
| ------------------------------- | ----------------- | --------- |
| Super SIM                       | 1 week            | 4-6 weeks |
| Super SIM Industrial / eSIM     | -                 | 4-6 weeks |
| Super SIM downloadable profiles | Immediate via API |           |

KORE warehouse - where the product is held in inventory by KORE; some SKU/form factors may not be held in inventory by KORE and may require a specific order from our supplier.

## Order quantities <a href="#order-quantities" id="order-quantities"></a>

| Product             | KORE Console    | Drop ship |
| ------------------- | --------------- | --------- |
| Super SIM Removable | 1 - 10k         | MoQ 10k   |
| Super SIM MFF2      | 10 / 100 / 1000 | MoQ 10k   |

* KORE Console - This could be an order placed through the console or your sales channel.
* Embedded (MFF2) products are delivered in bags or on reels and sealed in MSL 3 anti-static moisture barrier bags, then boxed for protection.
  * Bags
    * 10
    * 100
  * Reel sizes
    * 1000
    * 3000
    * 5000

## Form factors

KORE supports a wide range of form factors.

<figure><img src="https://778147064-files.gitbook.io/~/files/v0/b/gitbook-x-prod.appspot.com/o/spaces%2FuQQbnJlSgjMIxsWK06ol%2Fuploads%2FdRXQbD4Tv7tjXeIxPlSi%2Fimage.png?alt=media&#x26;token=5c432d74-6cf6-4f47-ad6c-3c5479f8cd23" alt=""><figcaption><p>Form factor options</p></figcaption></figure>

## Removable SIM card <a href="#removable-esim" id="removable-esim"></a>

### KORE Super SIM standard

<div align="left"><figure><img src="https://778147064-files.gitbook.io/~/files/v0/b/gitbook-x-prod.appspot.com/o/spaces%2FuQQbnJlSgjMIxsWK06ol%2Fuploads%2FfOXaYoIv73MVro9lB8hm%2Fsupersim.png?alt=media&#x26;token=874d6ded-defd-4b52-9380-8d0ddd612eb8" alt="Super SIM removable card" width="347"><figcaption><p>Super SIM card</p></figcaption></figure></div>

* The KORE Super SIM standard product is branded, industrial, and eSIM products will be provided in plain white format.
* ICCID is printed in full (20 digits) under the barcode, which also contains the ICCID in full, so it can be scanned with a barcode scanner.
* The pop-out/chip part has the ICCID printed on the back.
* On the back of the SIM, there is a 10 alpha-numeric code that can be used to register the SIM in the console ([korewireless.com/register-supersim](https://korewireless.com/register-supersim))

#### Physical characteristics

* The KORE Super SIM is crafted from ABS plastic, enhancing its durability for M2M/IoT applications, particularly in environments that reach temperatures up to 105°C. Furthermore, ABS plastic is more environmentally friendly than traditional PVC-based SIM cards, as recycling is easier.

## Embedded MFF2  <a href="#emedded-mff2-esim" id="emedded-mff2-esim"></a>

<div align="left"><figure><img src="https://778147064-files.gitbook.io/~/files/v0/b/gitbook-x-prod.appspot.com/o/spaces%2FuQQbnJlSgjMIxsWK06ol%2Fuploads%2Fmk7tbN8cjyToyo2axnv6%2Fembedded%20MFF2.png?alt=media&#x26;token=b9e5af9e-d052-43af-a710-77a729775278" alt="Embedded MFF2 SIM" width="264"><figcaption><p>Embedded MFF2 SIM</p></figcaption></figure></div>

* ICCID (marked in orange)
* Chip product code (marked in yellow) is related to supplier production and is not defined by KORE.

### Embedded MFF2 technical diagram <a href="#embedded-mff2-technical-diagram" id="embedded-mff2-technical-diagram"></a>

<div align="left"><figure><img src="https://778147064-files.gitbook.io/~/files/v0/b/gitbook-x-prod.appspot.com/o/spaces%2FuQQbnJlSgjMIxsWK06ol%2Fuploads%2FK0n592bQSfUy1ysRUDyx%2Fimage.png?alt=media&#x26;token=4a2f380c-28ac-4531-9cf4-3e2b9a48b4df" alt="Embedded MFF2 diagram" width="375"><figcaption><p>Embedded MFF2 diagram</p></figcaption></figure></div>

### Embedded MFF2 eSIM pin information <a href="#embedded-mff2-esim-pin-information" id="embedded-mff2-esim-pin-information"></a>

The key pin information for an embedded MFF2 eSIM module includes:

* **C1 - VDD/VCC**: Power supply
* **C2 - RST**: Reset signal
* **C3 - CLK**: Clock signal
* **C5 - VSS/GND**: Ground connection
* **C7 - IO**: Input/Output communication line

Section 5 of[ ETSI TS 102 221](https://www.etsi.org/deliver/etsi_ts/102200_102299/102221/17.01.00_60/ts_102221v170100p.pdf) outlines the characteristics of the eUICC PINs.

<div align="left"><figure><img src="https://778147064-files.gitbook.io/~/files/v0/b/gitbook-x-prod.appspot.com/o/spaces%2FuQQbnJlSgjMIxsWK06ol%2Fuploads%2FkH9vPf8i3QlFPVhN7AeX%2Fimage.png?alt=media&#x26;token=0e5884d5-c98e-4ece-bafe-13fc03d0c3b7" alt="eUICC pin diagram"><figcaption><p>eUICC pin diagram</p></figcaption></figure></div>