OmniSIM Product Datasheet

This documentation applies to the following products:

• OmniSIM

For all other products, please review their respective documentation

KORE OmniSIM SKU - Products

OmiSIM Product	Triple	2FF	3FF	MFF2	MFF4 (USON8-6)	Downloadable Profile (M2M)²
OmniSIM Reach 1.3	17493	17495	17494	17536	18491	17553
OmniSIM Rush 1.3	17496	17498	17497	17537	-	17554
OmniSIM US 1.3	17844	18643¹	18195	18642¹	-	-
OmniSIM KATTCC 1.3	17609	-	-	-	-	-
OmniSIM Reach 1.3.1	156130	171665	-	155402	-	-
OmniSIM Rush 1.4	19128	19129	19130	19131	19132	19133
OmniSIM US 1.4	19134	19135	19136	19137	19138	19139
OmniSIM KATTCC 1.4	19140	19141	19142	19143	19144	-
OmniSIM KATTCC	16665	17176	17175	17174	-	14505

• Offering as of 17-December-2025 subject to change.

• KORE SKU’s listed, if blank speak to your sales contact for options.

• ¹This SKU is not normally held in stock so see the lead time section to see lead time from the manufacturer.

• ²This downloadable SKU is available exclusively through the eSIM Switch feature, not the CPro Stock Order page.

Form Factors

KORE supports a wide range of form factors.

KORE SIM/eSIM Form Factors

Removable products the 4FF / Chip is the same thickness as the rest of the card as this helps get a good contact in a M2M device. The 4FF might be tight in a Smartphone that is expecting 0.67mm Nano SIM.

eSIM Specifications

KORE OmniSIM is engineered for the M2M/IoT market, utilizing an Industrial Grade chipset by default.

eSIM Hardware

Hardware Features	OmniSIM Removable / Embedded
AVAILABLE FORMATS	Triple / 2FF / 3FF / 4FF / MFF2 / MFF4(USON8-6)
CHIPSET	Infineon SLM 17ECB800B
MEMORY (FLASH)	800kb
MEMORY (RAM)	20kb
DATA RETENTION	10 years @ 25°C
ENDURANCE CYCLES (ETSI TS 102 221)	Min 3.2M Write / page (16 byte block) Min 200k Erase / page
VOLTAGE RANGE	1.62 – 5.5V External clock: 1 to 10 MHz
TEMPERATURE RANGE(TX)	-40°C to 105°C
HUMIDITY (HX)	85ºC, 85% humidity, 1000hrs
CORROSION (CX)	Salt atmosphere corrosion test: 24 hours

eSIM OS

OS Features	OmniSIM 1.3.x	OmniSIM 1.4
eUICC/eSIM OS	Kigen / EMu10.24	Kigen / EMu10.35
GSMA SGP	SGP.02 v4.2 (M2M)	SGP.02 v4.2 (M2M)
PROFILE	KORE Wireless	KORE Wireless
CONNECTVITY	2G/3G/4G/LTE/LTE-M - according to the profile	2G/3G/4G/LTE/LTE-M - according to the profile
JAVACARD	3.0.5	3.0.5
GLOBAL PLATFORM	2.1.1	2.1.1

SIM Standards

ISO Standards

• ISO 10373-1: Provides test methods for cards.

• ISO 7810: Establishes the physical characteristics of identification cards.

• ISO 7816: Specifies the characteristics of cards with contacts and their operational conditions.

ETSI Standards

• ETSI TS 101 220: Specifications for application management in a multi-application environment.

• ETSI TS 102 221: Technical specifications for the UICC-Terminal interface; Physical and logical characteristics.

• ETSI TS 102 241: Security architecture for Smart Cards.

• ETSI TS 102 267: Application Program Interface (API) for Open Platform.

• ETSI TS 102 671: Remote APDU structure for UICC based applications.

Security Certification

• Common Criteria EAL 5+: A security certification indicating a high level of assurance in the product's security features.

Product Compliance Information

• Export Control Classification Number (ECCN): 5A992.c

• U.S. Harmonized Tariff Schedule (HTS): 8523.52.0010

• Country of Origin: Varies, depending on the SIM supplier.

• ROHS Compliance: All KORE SIM suppliers adhere to ROHS standards. (Documentation available upon request)

• REACH Compliance: All KORE SIM suppliers meet REACH standards. (Documentation available upon request)

• Toxic Substances Control Act (TSCA): Complient to Section 6(h). (Documentation available upon request)

SIM Card Manufacturers

• Workz, Dubai

• Beautiful Card Company (BCC), Taiwan

These companies adhere to the SIM manufacturing process standards as outlined by the Global System for Mobile Communications Association (GSMA), specifically the Security Accreditation Scheme for UICC Production (SAS-UP) and the Security Accreditation Scheme for Subscription Management (SAS-SM)

Delivery Lead Times

Product	KORE Warehouse	Order from Manufacturer for existing SKU's
OmniSIM (Removable)	1 week	9 weeks
OmniSIM (Embedded)	1 week	9 weeks
OmniSIM Downloadable	Immediate	2 weeks

• KORE Warehouse - Where the product is held in inventory by KORE

• Order from Manufacturer - Where the product is not held in Kore inventory or when orders exceed the max allowed quantity from inventory

Order Quantities

Product	KORE CMP	Drop Ship from Manufacturer
OmniSIM (Removable)	1+	MoQ 20k
OmniSIM (Embedded)	Multiples of 500	MoQ 10k (Can supply in reels of 500 / 1000 / 3000 / 5000)

• KORE CMP - This could be an order placed through ConnectivityPro Stock Order or via your sales channel.

• Embedded (MFF2/USON) products are delivered on reels and sealed in MSL 3 anti static moisture barrier bags, then boxed for protection.

  • Reel Sizes

    • 500 (this is KORE's default size, held in stock)

    • 1000

    • 3000

    • 5000

Removable eSIM

Graphical Personalization

OmniSIM 1.3.x

OmniSIM 1.4

• Removable OmniSIM now comes in KORE Branded Half-Size format.

• EID is printed in full (32 digits) under the barcode which also contains the EID in full so can be scanned with a barcode scanner.

• The pop-out/chip part has the last 24 digits of the EID printed on the back. This is because the first 8 digits (89001039) are constant for KORE.

• SKU is now printed on the back of the card body for easy identification on the type of OmniSIM.

Physical Characteristics

• The KORE OmniSIM is crafted from ABS plastic, enhancing its durability for M2M/IoT applications, particularly in environments that reach temperatures up to 105°C. Furthermore, ABS plastic is more environmentally friendly compared to traditional PVC-based SIM cards, as it is easier to recycle.

Embedded MFF2 eSIM

Graphical Personalization

KORE MFF2 eSIM

• EID (marked in orange) is the last 27 digits. This is because the first 5 digits (89001) are constant for KORE.

• Chip product code (marked in yellow) is related to the Infineon production and is not defined by KORE.

Embedded MFF2 Technical Diagram

MFF2 Pin Layout

Embedded MFF2 eSIM Pin Information

The following documents the key pin information for an embedded MFF2 eSIM module:

• C1 - VDD/VCC: Power supply

• C2 - RST: Reset signal

• C3 - CLK: Clock signal

• C5 - VSS/GND: Ground connection

• C7 - IO: Input/Output communication line

Section 5 of ETSI TS 102 221 outlines the characteristics of the eUICC PINs.

MFF2 Bottom View

Embedded MFF4 (USON8-6) eSIM

Graphical Personalization

USON8-6 Markings

• EID (marked in orange) is the last 5 digits not including the 2 Luhn (check) digits on the end.

  • Example EID: 8900103945061014140000000 12345 80

  • The last 5 digits of the EID are 12345 and 80 is the Luhn (check) digits

• Chip product code (marked in yellow) is related to the Infineon production and is not defined by KORE.

Embedded MFF4 (USON8-6) Technical Diagram

Embedded MFF4 (USON8-6) eSIM Pin Information

The following documents the key pin information for an embedded USON8-6 eSIM module:

• C1 - VDD/VCC: Power supply

• C2 - RST: Reset signal

• C3 - CLK: Clock signal

• C5 - VSS/GND: Ground connection

• C7 - IO: Input/Output communication line

Section 5 of ETSI TS 102 221 outlines the characteristics of the eUICC PINs.

USON8-6 Bottom View